Summary
Evollabs Tech is a technology company developing customized server hardware for AI and machine learning, and is hiring an ASIC/SoC Package Design Engineer in Dubai. The role owns accelerator package development from architecture and die/package/board co-design through design, manufacturing engagement, package testing, and first-silicon bring-up. The engineer will work with multi-chiplet packages, high-speed interfaces, HBM, signal and power integrity, and thermal-mechanical design, while coordinating with foundries, OSATs, and suppliers. Applicants should have a relevant bachelor’s or master’s degree, at least 8 years of semiconductor package design experience, and proficiency with package EDA and SI/PI analysis tools.
The posting
As published on evollabs.tech. Pulled from the employer's site and shown as they wrote it.
Location: Dubai - UAE
Team: Hardware Engineering – Package Design & Bring-Up
Type: Full-time – On-site
About Us
We are a tech company specializing in the design and development of cutting-edge, customized server hardware solutions optimized for artificial intelligence and machine learning applications. Our mission is to empower businesses and researchers to accelerate their AI initiatives by providing them with high-performance, scalable, and energy-efficient hardware infrastructure. As a rapidly growing company at the forefront of AI hardware innovation, we are constantly seeking talented and motivated individuals to join our team. We offer a dynamic and challenging work environment, with opportunities to make a significant impact on the future of AI technology.
Your Mission
As a Package Design Engineer, you will own the chip package of our AI accelerators end to end, from packaging technology selection and die/package/board co-design through substrate and interposer design, package-level test, and first-silicon bring-up. You will turn multi-chiplet silicon with demanding high-speed interfaces into robust, manufacturable, high-performance packages, working at the intersection of silicon design, signal and power integrity, thermal-mechanical engineering, and the foundry/OSAT supply chain.
Responsibilities
• Package architecture and technology selection: evaluate standard flip-chip BGA and advanced packaging options (2.5D silicon interposer, silicon bridge, fan-out, 3D stacking) against product requirements, and drive die/package/board co-optimization of floorplans, bump patterns, pad rings, and ball-out with silicon and system teams.
• Multi-chiplet package design: own substrate and interposer design for multi-die assemblies, including netlist management, routing, layer stack-up definition, and design-rule compliance across compute, memory, and I/O chiplets.
• High-speed interface packaging: deliver package channels that meet the budgets of PCIe Gen5/Gen6, 400/800G Ethernet (56G/112G PAM4 SerDes), HBM, and UCIe/BoW die-to-die links, collaborating with signal and power integrity engineers on extraction, simulation, and margin sign-off.
• Power, thermal, and mechanical co-design: define the package PDN, decoupling strategy, and thermal solution for high-power accelerator silicon, and manage warpage, CTE mismatch, and reliability risks together with thermal-mechanical engineers.
- Manufacturing and supply-chain execution: engage foundries, OSATs, and substrate suppliers on design rules, DFM feedback, assembly flows, qualification, and yield improvement, and drive package NPI from tape-out to production release.
- Package test and silicon bring-up: define package-level test and characterization plans, support first-silicon bring-up in the lab, and lead package-related debug and failure analysis through to root cause and corrective action.
• Cross-functional collaboration and documentation: write clear package specifications, design guidelines, and review material, and lead design reviews with silicon, board, SI/PI, thermal, and product engineering teams.
Requirements
• Bachelor’s or Master’s in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 8+ years in semiconductor package design, with a strong focus on high-performance digital ASICs, GPUs, or AI accelerators.
• Proven track record of taking complex multi-chiplet packages (2.5D interposer, silicon bridge, or fan-out based) from concept to production.
• Hands-on experience with both standard flip-chip BGA and advanced packaging technologies such as CoWoS, EMIB, InFO/FoCoS, or equivalent foundry and OSAT platforms.
• Package design experience for high-speed serial interfaces, specifically PCIe Gen5/Gen6 and 400/800G Ethernet, including breakout, escape routing, and channel budget ownership.
• Experience with die-to-die interconnects such as UCIe or Bunch of Wires (BoW), including bump map definition, channel design, and routing rules for D2D links.
• Experience integrating HBM or similar memory subsystems on interposer or bridge, including routing, stack-up, and assembly considerations.
• Solid grounding in package signal and power integrity, transmission line theory, and PDN design, with the ability to drive and interpret extraction and simulation results.
• Working knowledge of thermal and mechanical fundamentals for large-body, high-power packages, including warpage control and JEDEC reliability qualification.
• Experience supporting package test, characterization, first-silicon bring-up, and failure analysis in collaboration with test and product engineering.
• Proficiency with package EDA tools such as Cadence APD/SiP Layout or Synopsys 3DIC Compiler, plus familiarity with SI/PI analysis tools (Ansys HFSS/SIwave, Cadence Clarity/Sigrity, or similar).
• Excellent cross-functional communication and documentation skills, including experience working directly with foundry, OSAT, and substrate vendor engineering teams.
Preferred Qualifications (Nice-to-Haves)
• Experience with 3D stacking and hybrid bonding technologies (SoIC, Foveros, or similar) and their design and test implications.
• Exposure to co-packaged optics or photonics packaging for high-bandwidth I/O.
- Experience defining packaging testchips and running technology qualification vehicles with foundry or OSAT partners.
- Hands-on use of thermal and mechanical simulation tools (Ansys Icepak, Celsius, mechanical FEA) for package-level analysis.
• Familiarity with UCIe compliance and interoperability testing, or participation in chiplet standards bodies (UCIe Consortium, OCP ODSA).
• Experience managing OSAT and substrate vendor relationships, schedules, and cost trade-offs during NPI.
Why Join Us
• Own the package of a next-generation AI accelerator from first concept to working silicon, where your decisions directly set the product’s performance, power, and cost.
• Work in a tight cross-functional team of silicon, board, SI/PI, and thermal engineers that values technical depth and hands-on problem solving.
• Cover the full scope in one role: architecture, design, supplier engagement, lab bring-up, and production ramp.
• Competitive compensation, growth opportunities, and the chance to help define the platform that powers advanced AI workloads.
Ready to Accelerate the Future of AI?
If you’re passionate about turning multi-chiplet silicon into robust, high-performance packages
— we’d love to hear from you.
Apply now and help us deliver production-ready platforms that make AI faster, safer, and more
efficient.